Potting glue is a broad term. It is used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before curing and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. The potting glue can realize its use value only after it is completely cured.

Silicone encapsulant
      The long-term and effective protection of sensitive circuits and electronic components undoubtedly plays an increasingly important role in today's sophisticated and high-demand electronic applications. Silicone potting compounds have stable dielectric insulation, which is an effective guarantee to prevent environmental pollution. At the same time, it can eliminate the stress caused by shock and vibration in a large temperature and humidity range, and can meet the special requirements of bonding, thermal conductivity, flame retardancy, high transparency, etc. After curing, it becomes a flexible elastomer; the curing speed is uniform, and it is compatible with irrigation. The thickness of the seal has nothing to do with the airtightness of the environment.

epoxy resin encapsulant
      Epoxy potting adhesive has good fluidity and is easy to penetrate into the gap of the product; it can be cured at room temperature or medium temperature, and the curing speed is moderate; after curing, there is no bubbles, the surface is smooth, shiny and high in hardness; the cured product has good acid and alkali resistance, Moisture-proof, waterproof, oil-proof and dust-proof, resistant to humidity and heat and atmospheric aging; it has good electrical and physical properties such as good insulation, compression resistance, and high bonding strength.
Application areas:
LED, automotive electronics, regulators, industrial electronics, relays, controllers, power modules, sensors.

Polyurethane potting compound
      Polyurethane elastic encapsulant overcomes the disadvantages of commonly used epoxy resin brittleness and low strength and poor adhesion of silicone resin, and has excellent water resistance, heat resistance, cold resistance, UV resistance, acid and alkali resistance, and high and low temperature impact resistance. , Moisture-proof, environmental protection, high cost performance, is an ideal potting protection material for electronic components.
Application areas:
      Transformers, choke coils, converters, capacitors, coils, inductors, varistors, linear motors, stationary rotors, circuit boards, electromagnets, pre-mold use, LEDs, pumps, transfer switches, plugs, cable bushings, ultrafiltration components , reverse osmosis membrane modules.